We work with clients to develop custom applications, while Coupi software is available for direct license to help you build industry-specific simulations.
Our Latest Project
Mapping punch sticking risk by modeling tablet compaction and detachment processes
Coupi developed a Polyphysica discrete element method punch sticking model to simulate punch sticking risk for a double punch die tablet press and to construct punch sticking risk maps. The model takes into account cohesive and adhesive interactions of API and excipient particles with each other, punch surfaces, and the die wall. The model provides a possible path to reducing sticking risk through careful selection of excipients.
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3061 Monteverde Rd.
Fairbanks, Alaska 99709